Advanced Packaging Core Material-Polyimide

Polyimide has become an advanced packaging core material. Modern electronic packaging technology needs to integrate interconnection, power, cooling and passivation protection of devices to ensure the best performance and reliability of devices. Polyimide meets the requirements of high purity, high heat resistance, high mechanical properties, high insulation performance and high frequency stability to a great extent. With the requirements of low dielectric constant and dielectric loss, low moisture absorption, low internal stress, low expansion coefficient and low molding process temperature, it has become the core material of advanced packaging.