Manufacturer of Low Expansion Polyimide Film

Although PI film has excellent thermal stability, mechanical and electrical properties, the thermal expansion coefficient of PI film is much larger than that of inorganic materials. When PI materials form composite materials with inorganic materials such as metals and ceramics, the existence of thermal stress will cause the polymer layer and inorganic substrate to warp, crack or delaminate.

Therefore, how to reduce the thermal expansion coefficient of PI has become one of the research directions of PI films. A large number of structural studies show that aromatic PI with rigid rod structure has a relatively straight molecular chain, so it is closely packed between molecules, which is beneficial to reduce the free volume of polymer and the coefficient of thermal expansion.