Performance of Polyimide Film #2

Performance                    

High temperature resistance   

The decomposition temperature exceeds 500 ℃, the decomposition temperature of polyimide synthesized by biphenyl dianhydride and p-phenylenediamine can reach 600 ℃.

Low teperuature resistance

It will not be brittle in liquid helium at -260℃

High mechanical strength

The film of homophenyl polyimide is 250Mpa; The film of biphenyl polyimide can reach 530Mpa.

Dilute acidity Resistance

Usually, it is insoluble in organic solvents and has stable dilute acid resistance.

Low thermal expansion coefficient

The thermal expansion coefficient is usually at 2-3*10-5/ ℃; Biphenyl type can reach 10-6/ ℃.

Radiation resistance

The film can keep 90|% of its performance after strong radiation.

Good dielectric property

The dielectric constant is generally about 3.4, the dielectric strength is 100-300 KV/mm, the volume resistance is 1017Ω.cm, and the dielectric loss is 10-3.

Self-extinguishing flame retardant

The smoke generation rate is extremely low, and the gas emission under extremely high vacuum is very small.

Non-toxic

Some polyimide has good biocompatibility.